Apparatus For Dispensing Flux-Free Solder On A Substrate

ABSTRACT

An apparatus for dispensing flux-free solder comprises a dispenser head with a stamp to which ultrasound can be applied. Solder is dispensed by:
     A) moving the dispenser head above a next substrate place,   B) lowering the stamp until the working surface of the stamp touches the substrate place or is located at a predetermined height above the substrate place,   C) dispensing solder by:
       C1) advancing the solder wire until the solder wire touches the substrate place, in such a manner that the tip of the solder wire touches the substrate place within a recess of the stamp,   C2) further advancing of solder wire to melt a predetermined quantity of solder, and   C3) retracting the solder wire,   
       D) moving the dispenser head to distribute the solder on the substrate place, and simultaneously applying ultrasound to the stamp, and   E) raising the stamp.

PRIORITY CLAIM

Applicant hereby claims foreign priority under 35 U.S.C. §119 from SwissPatent Application No. 1044/12 filed Jul. 5, 2012, the disclosure ofwhich is herein incorporated by reference.

FIELD OF THE INVENTION

The invention relates to an apparatus for dispensing flux-free solder ona substrate.

BACKGROUND OF THE INVENTION

Soldering methods of this kind are typically but not exclusively used inthe mounting of semiconductor chips on a metallic substrate, a so-calledleadframe. Power semiconductors are usually mainly connected by means ofsoft soldering with the substrate, which usually consists of copper, inorder to ensure a more effective dissipation of the heat losses from thesemiconductor chip via the soldered joint in comparison with mounting bymeans of an adhesive. High requirements are placed on the homogeneity ofthe soldered joint, especially in the case of increased power density,i.e. a defined thickness, even distribution and perfect wetting of thesolder layer over the entire chip area as well as complete freedom frombubbles and purity of the soldered joint are demanded. On the otherhand, the solder should not escape laterally from the soldering gap andspread next to the semiconductor chip, which again requires precisedosing and positioning of the solder portions.

In the field of mounting semiconductor chips a method is widely spreadin practical use in which the end of a solder wire is brought intocontact with the substrate that his heated over the melting temperatureof the solder in order to melt down a piece of the wire. This method isgenerally well suited for mass production due to its simplicity andflexibility. However, the obtained approximately circular wettingsurface is badly adapted to the rectangular or square shape of thesemiconductor chips. A punching die is further known from U.S. Pat. No.6,056,184 with which the portion of solder deposited on the substratecan be brought into a flat shape which is adjusted to the rectangularshape of the semiconductor chips. It is also known to move the end ofthe soldering metal wire with a writing head along a specific path, withthe heated substrate continuously melting down the solder. A track ofsolder is thereby deposited on the substrate.

From U.S. Pat. No. 5,878,939 a method is known in which liquid solder isinjected into a cavity formed between a molding die and the substrate.

These known methods come with a number of disadvantages. The shape ofthe deposited solder is either round or a specific punching die needs tobe produced for every rectangular shape. Such a punching die comprisesside walls which cover a part of the substrate. The solder can thereforenot be applied up to the edge of the chip island which accommodates thesemiconductor chip. Moreover, the substrate needs to be heated up overthe melting temperature of the solder and the deposited solder needs tobe kept in liquid form from the application until the placement of thesemiconductor chip. It is also disadvantageous that the parts that comeinto contact with the liquid solder need to be cleaned regularly, forwhich purpose production needs to be interrupted.

From U.S. Pat. No. 4,577,398 and U.S. Pat. No. 4,709,849 a method isknown in which flat preforms made of soldering metal (so-called “solderpreforms”) are prefabricated, the dimensions of which are adjusted tothe semiconductor chips. The solder preforms are then placed on thesubstrate and molten down by the same in order to form a soldering layerin the required dimensions. This method is relatively expensive andoffers little flexibility due to the required prefabrication of thesolder preforms and the additional mounting operations.

From US 2009-145950 a method and apparatus are known in which a solderwire is guided through the writing head of a solder dispenser, with thewire being brought into contact with the heated substrate when applyingthe solder, so that the solder will melt at the end of the wire, andwith the writing head being moved along a predetermined path parallel tothe surface of the substrate. The solder dispenser writes a solder trackin this manner on the substrate. It is disadvantageous in this methodthat the substrate can only be wetted insufficiently without precedingcleaning.

SUMMARY OF THE INVENTION

The invention is based on the object of developing a method andapparatus for the application of flux-free solder to a substrate whichno longer shows the mentioned disadvantages.

The method for dispensing flux-free solder onto substrate places of asubstrate uses a dispensing apparatus comprising a dispenser head whichcomprises a stamp, an ultrasonic head configured to apply ultrasound tothe stamp and a wire feed. The stamp has a working surface which has arecess open to a lateral surface of the stamp. The wire feed feeds thesolder wire under an angle diagonally to the surface of the substrate.The method comprises the following steps:

-   A) moving the dispenser head to a predetermined position above the    next substrate place onto which solder is to be dispensed,-   B) lowering the stamp until    -   B1) the working surface of the stamp touches the substrate        place, or    -   B2) the working surface of the stamp is located at a        predetermined height above the substrate place, or    -   B3) the working surface of the stamp touches the substrate        place, and raising the stamp to a predetermined height above the        substrate place,        wherein the height mentioned in B2 and B3 is set in such a        manner that the working surface of the stamp is wetted with        solder in the later following step D,-   C) dispensing flux-free solder to the substrate place by:    -   C1) advancing the solder wire until the solder wire touches the        substrate place, in such a manner that the tip of the solder        wire touches the substrate place within the recess of the stamp,    -   C2) further advancing of solder wire, in order to melt a        predetermined quantity of solder, and    -   C3) retracting the solder wire,-   D) moving the dispenser head along a predetermined path in order to    distribute the solder on the substrate place, and simultaneously    applying ultrasound to the stamp, and-   E) raising the stamp, wherein    step D is carried out either after step C3 or already begins during    step C2.

The method preferably further comprises feeding the solder wire througha nozzle and actively cooling the nozzle.

According to the invention, an apparatus for dispensing flux-free solderonto substrate places of a substrate comprises

a dispenser head, which is movable in two horizontal directions, and,optionally, in the vertical direction, comprising

an ultrasonic head,

a stamp having a working surface, which has a recess open toward alateral surface of the stamp, wherein the stamp is fastenable on theultrasonic head,

a wire feed having a nozzle having a longitudinal borehole, throughwhich the solder wire can be guided, wherein a longitudinal axis of thewire feed, which extends through the longitudinal borehole of thenozzle, enters at the lateral surface of the stamp into the recess andis incident on the substrate within a part of the working surfacebounded by the recess, and

a cooling device, which is configured to keep the working temperature ofthe stamp at a predetermined temperature.

The apparatus preferably further comprises a further cooling device forcooling the nozzle of the wire feed.

The apparatus preferably further comprises a drive fastened on thedispenser head, which is configured to move the ultrasonic head with thestamp up and down in the vertical direction.

Preferably, the recess of the stamp is coated with a material whichpoorly wets flux-free solder.

BRIEF DESCRIPTION OF THE DRAWING FIGURES

The accompanying drawings, which are incorporated into and constitute apart of this specification, illustrate one or more embodiments of thepresent invention and, together with the detailed description, serve toexplain the principles and implementations of the invention. The figuresare not to scale. In the drawings:

FIG. 1 schematically shows a side view of a dispenser head of adispensing station of a machine for soldering semiconductor chips on asubstrate,

FIG. 2 shows a stamp, and

FIG. 3 shows a path, which the stamp covers on a substrate place.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 schematically shows a side view of those parts of a dispensingstation of a machine for soldering semiconductor chips on a substratewhich are required for understanding the invention. The dispensingstation comprises an apparatus for applying flux-free solder onto theindividual substrate places of a substrate 1. The substrate 1 rests on aheatable support 3. The apparatus comprises a dispenser head 2, which ismovable in two horizontal directions, designated with x and y, and,optionally, can be raised and lowered in the vertical direction,designated with z. The dispenser head 2 comprises an ultrasonic head 4,on which a stamp 5 is removably fastened, and a wire feed 6. Theultrasonic head 4 is configured to apply ultrasound to the stamp 5,preferably longitudinal ultrasonic waves, which run in the z direction,i.e. their oscillation direction is directed perpendicularly to thesupport 3. The frequency of the ultrasonic waves is preferably in therange from 40 kHz to 200 kHz, typically at approximately 60 kHz. Theprocessing of the substrate 1 with ultrasound improves the wettingability locally on the surface on which the solder is desired, and thusreduces the undesired running over of the solder, which is known intechnical jargon as “solder bleed out”.

The wire feed 6 comprises a nozzle 7, e.g., a capillary made of ceramic,having a longitudinal borehole, through which the solder wire 8 isguided, and drive means, in order to advance and retract the solder wire8. The drive means comprise, for example, a drive roller 9 driven by amotor and a counter pressure roller 10, between which the solder wire 8is guided through. The solder wire 8 is typically wound onto a roll,which is either arranged in a stationary manner on the dispensingstation or is arranged on the dispenser head 2.

The stamp 5 has a working surface 11 facing toward the substrate 1,which is used to distribute the solder. The stamp 5 is implemented witha recess 12, which leads from a lateral surface 13 of the stamp 5 facingtoward the wire feed 6 to the working surface 11 and therefore opensinto the working surface 11. The nozzle 7 is aligned diagonally to thevertical at a predetermined angle α and is arranged in such a mannerthat a longitudinal axis 14 of the wire feed 6, which extends throughthe longitudinal borehole of the nozzle 7, enters at the lateral surface13 of the stamp 5 into the recess 12 and is incident on the substrate 1within the part of the working surface 11 bounded by the recess 12.

FIG. 2 shows the stamp 5 placed on a substrate 1 in a perspective view.It can be seen clearly therein that the solder wire 8 is incident on thesubstrate 1 within the recess 12 of the stamp 5, and since thetemperature of the substrate 1 is higher than the melting temperature ofthe solder, the end of the solder wire 8 melts. As a result of theformation of the stamp 5 of the dispenser head 2 with the recess 12 andthe diagonal feed of the solder wire 8, the tip of the solder wire 8touches the substrate place within the recess 12 of the dispenser head2. The solder wire 8 does not touch the stamp 5: the melting of soldertherefore occurs due to the contact with the hot substrate 1 and not dueto contact with the stamp 5. The recess 12 of the stamp 5 thereforerepresents, as can be clearly seen in FIG. 2, a cavity which is opentoward the wire feed 6 and toward the working surface 11. The cavity isbounded on the side facing toward the substrate 1 on three sides and isonly open toward the wire feed 6.

The stamp 5 or at least its working surface 11 preferably consists of acopper alloy such as brass or bronze, or of a silver-copper alloy havinga high proportion of silver and a low proportion of copper, which theflux-free solder wets well. The surface of the stamp 5 delimited by therecess 12 can be coated with a material which is poorly wettable withsolder. Chromium is such a material, for example. This prevents solderfrom adhering to the inner side of the recess 12, which could have theresult that the quantity of solder delivered is not always equal. Theouter side of the stamp 5 can also be coated with such a material.

The dispenser head 2 preferably has a first cooling device 15 (FIG. 1),which ensures that the temperature of the solder wire 8 within thenozzle 7 is below the melting temperature of the solder and the solderwire 8 remains sufficiently stiff to be able to be advanced or retractedby the drive means.

The temperature of the support 3 and therefore also the temperature ofthe substrate 1 are above the melting temperature of the solder.Essential parts of the apparatus protrude additionally into a nearlyclosed chamber (a furnace), in which typically a N₂H₂ atmosphereprevails, in order to reduce oxides formed on the substrate.

The melting temperature of flux-free solders is typically in a range of300 to 320° C. The support 3 is heated to a temperature above this,typically of 360-380° C. A temperature of 360-380° C. then also prevailsrelatively rapidly in the furnace. These values are examples, they candeviate therefrom in the specific case.

The dispenser head 2 therefore preferably has a second cooling device 16(FIG. 1), which is used for the purpose of keeping the temperature ofthe stamp 5 within a predetermined temperature window. The coolingdevice 16 is therefore configured to regulate the temperature of thestamp 5 to a predetermined working temperature. The working temperatureis in the range of the melting temperature of the solder, typicallywithin a processing window which extends from a few degrees Kelvin belowthe melting temperature up to a few degrees Kelvin above the meltingtemperature of the solder. Experiments have shown that a to low workingtemperature has the result that solder collects on the working surfaceof the stamp, which falls off of the stamp 5 from time to time, while ato high working temperature can result in erosion of the stamp 5. Thecooling device 16 is used for the purpose of dissipating heat from thestamp 5, so that the working temperature of the stamp 5 remains withinthe predetermined temperature window, in which these effects do notoccur or are at least greatly reduced.

The cooling device 16 can contain an integrated heater, which is usedfor the purpose of heating the stamp 5 to the working temperature beforethe beginning of the mounting process, on the one hand, and which isused for the purpose of regulating the temperature of the stamp 5 to thedesired working temperature together with the cooling device 16, on theother hand.

Since the dispenser head 2 has a rather high mass and therefore also arelatively large inertia because of the diverse components, it isadvantageous to attach a drive 17 on the dispenser head 2, which allowsthe ultrasonic head 4 with the stamp 5 to be moved up and down in thevertical direction, i.e., in the z direction. A voice coil detector, forexample, is provided for detecting the point in time at which the stamp5 comes into contact with the substrate 1 as it is lowered.

The method according to the invention for applying flux-free solder ontothe substrate places of the substrate 1 comprises the following steps,for which purpose the above-described dispensing apparatus is used:

-   A) moving the dispenser head 2 to a predetermined position above the    next substrate place onto which solder is to be dispensed,-   B) lowering the stamp 5 until    -   B1) the working surface 11 of the stamp 5 touches the substrate        place, or    -   B2) the working surface 11 of the stamp 5 is located at a        predetermined height above the substrate place, or    -   B3) the working surface 11 of the stamp 5 touches the substrate        place, and raising the stamp 5 to a predetermined height above        the substrate place,        wherein the height mentioned in B2 and B3 is set in such a        manner that the working surface 11 of the stamp 5 is wetted with        solder in the later following step D,-   C) dispensing flux-free solder to the substrate place by:    -   C1) advancing the solder wire 8 until the solder wire 8 touches        the substrate place, in such a manner that the tip of the solder        wire 8 touches the substrate place within the recess 12 of the        stamp 5,    -   C2) further advancing of solder wire 8, in order to melt a        predetermined quantity of solder, and    -   C3) retracting the solder wire 8,-   D) moving the dispenser head 2 along a predetermined path in order    to distribute the solder on the substrate place, and simultaneously    applying ultrasound to the stamp 5, and-   E) raising the stamp 5, wherein    step D is carried out either after step C3 or already begins during    step C2.

If steps C2 and D are carried out simultaneously, this means that thedrive means continuously advance the solder wire 8 and solder iscontinuously melted off from its end. The predetermined path can bedesigned in such a manner that the stamp 5 partially protrudes beyondthe edge of the substrate place. In this manner, the solder cancompletely cover the substrate place. The application of ultrasound tothe stamp 5 causes the solder to be well wetted on the substrate place.In order to prevent solder from spraying away, the application of thesolder advantageously begins in the center of the substrate place, sothat it is very well wetted there and no longer flows away.

It is possible to vary the strength and the frequency of the ultrasonicwaves according to a predetermined profile, in particular, single ormultiple ultrasonic pulses (ultrasonic bursts) can be applied.

Since the solder wire 8 conducts heat extraordinarily well, it alwaysabsorbs heat when it is brought into contact with the substrate 1 instep C to deposit a solder portion, whereby the nozzle 7 and/or furthercomponents of the wire feed 6 heat up. The nozzle 7 is thereforeactively cooled by the cooling device 15 if necessary, so that thetemperature of the solder wire 8 remains below its melting temperatureand the solder wire 8 remains sufficiently stiff to be able to be pushedout of the nozzle 7 and retracted back into the nozzle 7 by the drivewithout problems.

In many applications, the semiconductor chip is mounted on a substrateplace 18, whose dimensions are approximately equal to the dimensions ofthe semiconductor chip. The substrate is typically a so-called leadframe. The substrate place 18 is connected via thin webs (not shown) tothe frame of the lead frame. The solder portion must then typicallycover the entire substrate place 18. To achieve this, it is advantageousto move the stamp 5 along a path 19, which leads at least partiallyalong the edge 20 of the substrate place 18 and is determined in such amanner that the working surface 11 of the stamp 5 protrudes beyond theedge 20 and therefore only still partially touches the substrate place18. FIG. 3 illustrates this. Those parts of the path 19 in which theworking surface 11 of the stamp 5 protrudes beyond the edge 20 are shownby solid arrows, the remaining parts of the path 19 are shown by dashedarrows. The path 19 begins in the center or close to the center of thesubstrate place 18 and then first leads along path sections located inthe interior of the substrate place 18 step-by-step outward until itfinally leads along the edge 20 of the substrate place 18. In otherwords, the path 19 leads from the inside to the outside. Since in thecase of such a path 19, firstly the regions of the substrate place 18located in the interior are treated with ultrasound, the solder wetswell there, so that as a result no solder is sprayed away from thesubstrate place 18. The path 19 is only shown as an example here, it canalso be composed of other path sections. In this example, the outline ofthe working surface 11 of the stamp 5 is square, however, it can also berectangular or round or have any arbitrary other shape. It isadvantageous in the case of certain applications to move the stamp 5 atthe starting point of the path 19 in the direction which is opposite tothe lateral surface 13 having the recess 12. As a result of thecapillary effect, the molten solder is nonetheless distributed.

While embodiments and applications of this invention have been shown anddescribed, it would be apparent to those skilled in the art having thebenefit of this disclosure that many more modifications than mentionedabove are possible without departing from the inventive concepts herein.The invention, therefore, is not to be restricted except in the spiritof the appended claims and their equivalents.

1-16. (canceled)
 17. An apparatus for dispensing flux-free solder ontosubstrate places of a substrate, comprising a dispenser head, which ismovable in two horizontal directions, and, optionally, in the verticaldirection, comprising an ultrasonic head, a stamp having a workingsurface, which has a recess open toward a lateral surface of the stamp,wherein the stamp is fastenable on the ultrasonic head, a wire feedhaving a nozzle having a longitudinal borehole configured to guide thesolder wire, wherein the wire feed is mounted on the dispenser head suchthat an axis, which extends through the longitudinal borehole of thenozzle, enters at the lateral surface of the stamp into the recess andis incident on the substrate within a part of the working surfacebounded by the recess, and a cooling device, which is configured to keepthe working temperature of the stamp at a predetermined temperature. 18.The apparatus according to claim 17, further comprising a furthercooling device for cooling the nozzle of the wire feed.
 19. Theapparatus according to claim 17, further comprising a drive fastened onthe dispenser head, which is configured to move the ultrasonic head withthe stamp up and down in the vertical direction.
 20. The apparatusaccording to claim 18, further comprising a drive fastened on thedispenser head, which is configured to move the ultrasonic head with thestamp up and down in the vertical direction.
 21. The apparatus accordingto claim 17, wherein the recess of the stamp is coated with a materialwhich is poorly wettable by flux-free solder.
 22. The apparatusaccording to claim 18, wherein the recess of the stamp is coated with amaterial which is poorly wettable by flux-free solder.
 23. The apparatusaccording to claim 19, wherein the recess of the stamp is coated with amaterial which is poorly wettable by flux-free solder.
 24. The apparatusaccording to claim 20, wherein the recess of the stamp is coated with amaterial which is poorly wettable by flux-free solder.